Tech

T-Global Technology Partners with France's SiPearl to Advance Next-Generation HPC Cooling Technologies

Taiwan’s A+ Innovation Program just green-lit a two-phase liquid-cooling module that targets >250 W/cm² heat flux—enough to tame SiPearl’s 7 nm Rhea-HPC chip at full TDP. By bonding copper-graphene composites directly to the die, the design ditches thermal interface layers, cutting junction-to-fluid resistance below 0.05 K/W and slashing pump power by 40 % for exascale racks.

T-Global Technology, a Taiwanese company, has partnered with SiPearl, a European fabless designer of high-performance CPUs, to develop advanced thermal management solutions for next-generation computing platforms. The collaboration, which is part of Taiwan's A+ Driving Industrial Innovation with AI Program, aims to deliver innovative cooling technologies that support higher chip performance while reducing energy consumption.

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T-Global's flagship project,

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